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With 40°C inlet water and approximately 7 kPa pressure drop, GOTCOOL kept maximum chip junction temperature within 105°C and completed design, manufacturing, and validation in 18 days.
Define heat load, the technology loop, facility interfaces, controls, validation and delivery boundaries before selecting hardware.
Review L2L or L2A architecture, system curves, exact redundant elements, controls and service access instead of nameplate duty alone.
Cover installation, flushing, pressure and leakage, filling and venting, controls, redundancy changeover and loaded acceptance.
Review coolant, water quality, the complete wetted-material system, verification methods and operating controls.
Cold-plate cooling moves coolant through plates coupled to chips (indirect); immersion contacts devices directly with media. Cold plate suits mainstream AI/HPC (mature, serviceable, cost-controlled — 550 W-class chips measured at 91 °C); immersion suits extrem
A CDU is the interface and control node of a liquid-cooling system: a plate heat exchanger thermally isolates the IT secondary loop from the facility primary side, pumps drive coolant to capture chip heat, and filtration, venting, make-up, leak detection and i
Pressure drop decides pump sizing and energy: too high needs bigger pumps (more power and noise); too low starves flow and chips overheat. Rack-level systems target ≤80 kPa; the 550 W cold plate measures only 5.8 kPa; manifold branches, fittings and tubing all
Coolant and wetted materials (metals, seals, hoses, fittings) decide system life: leachables foul microchannels and corrosion products block flow. Run leaching, permeation and aging tests before selection; common media are ethylene/propylene glycol solutions a
Release validation has four levels: component (cold-plate thermal, quick-connect cycling and leak), loop (measured flow/pressure/temperature), rack (full, partial and single-branch maintenance states) and system (interlocks, power recovery, redundancy switchov
Liquid cooling cuts cooling energy sharply: fully liquid-cooled cooling-side pPUE can reach 1.04 and 50/50 mixed about 1.16 (Inspur public data); marketing figures like "up to 40% power and 40% water savings at 45 °C without chillers" are vendor estimates for
An L2A CDU rejects secondary-loop heat to room air or outdoors through a liquid-to-air heat exchanger — deployable without facility water, ideal for retrofits and no-chiller sites. Mainstream units run 70 kW class (10-80 kW); verify room sensible capacity, air