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Support / Technical answers
Direct, data-backed answers to the questions that matter before and during deployment.
Release validation has four levels: component (cold-plate thermal, quick-connect cycling and leak), loop (measured flow/pressure/temperature), rack (full, partial and single-branch maintenance states) and system (interlocks, power recovery, redundancy switchover). Key figures are measured — the 550 W cold plate at 91 °C / 5.8 kPa.
Thermal (chip temperature, uniformity), hydraulic (flow, pressure drop, branch deviation ≤10%), sealing (leak, pressure), control (alarms, interlocks, power recovery, switchover) and reliability (cycling, vibration, endurance).
Acceptance criteria are written into the delivery file: full-load chip temperature below the junction limit with margin, pressure drop inside budget, single-branch isolation without rack impact, power recovery per strategy.
Separate prototype validation (design) from batch validation (consistency). Venting, flushing and water quality complete before delivery; records ship with the system.