正在加载…
正在加载…
Support / Technical answers
Direct, data-backed answers to the questions that matter before and during deployment.
Direct liquid cooling usually covers only major heat sources; memory, power, networking and auxiliary devices still generate heat. Quantify residual air heat and make the boundary explicit: uncovered heat is removed by rack airflow or captured by rear-door heat exchangers (RDHx, 120 kW class), with full-load measurements confirming no hot spots.
Depends on coverage: after chip-level cold plates, the heat of memory, power, networking and auxiliaries is residual — build a device-level heat inventory.
Rack airflow removes low residual loads; RDHx rear-door units capture higher loads directly. Hybrid layouts are sized from the residual heat.
"Fully liquid cooled" is a common misread: measure all device temperatures at full load before delivery and document the liquid/air boundary in the delivery file.