Technology / Chip-level heat capture / R&D case

Cold-plate and flow-path engineering for high-heat-flux AI chips

For a 550 W AI compute chip, staggered jet impingement and skived microchannels were studied together to balance hotspot suppression, temperature uniformity and flow resistance at a defined operating point.

Step 01

Solution inputs

550 W | Total chip heat load
300 W/cm² | Average heat flux
91 °C | Simulated maximum chip temperature
5.8 kPa | Simulated system pressure drop

Step 02

System path

1. Physical model

Build the chip heat map, material stack, contact interfaces and fluid domain, then define heat load, flow and boundary conditions.

2. CFD simulation

With the microchannel geometry fixed, compare jet count and layout through temperature, velocity and pressure fields.

3. Manufacturing route

Use an oxygen-free high-conductivity copper base, precision-milled microchannels, fiber-laser jet holes and vacuum-brazed sealing.

4. Experimental correlation

Use a liquid-loop rig to compare flow-pressure and cooling data, then plan thermal-cycling and vibration reliability tests.

Step 03

Before implementation

An expanding inlet and distribution layer improve flow uniformity before the jet array.
Jets attack the high-flux region while staggered skived fins redirect and re-accelerate coolant to repeatedly disrupt the thermal boundary layer.
The design must balance maximum temperature, surface uniformity, pressure drop, pumping demand, material compatibility and manufacturing tolerance.

Step 04 — Result

Operational outcomes

Clarifies the engineering decision before equipment selection

Engineering details

Decision inputs and delivery evidence

Decision inputs

0.8 mm jet diameter and 2 mm target distance
22 staggered jet holes at the studied flow rate of 1.5 L/min
300 W/cm² average heat flux with local peaks up to 600 W/cm²
A 120 °C chip junction-temperature limit used as the study boundary

Validation and delivery evidence

Evidence boundary: 91 °C and 5.8 kPa are simulation results for this research design point and are not guaranteed values for other chips or production models.
Initial liquid-loop comparison supports use of the SST turbulence model within this project’s engineering tolerance; production specifications remain subject to the target chip, package, coolant and system boundary.

The difficulty of chip-level heat capture is hot-spot suppression: at 300 W/cm² average, local peaks reach 608 W/cm², where plain microchannels form temperature bottlenecks. Jets remove the boundary layer, staggered fins extend the area — together they capture high heat flux at low flow.

A 550 W chip measures 91 °C peak and 5.8 kPa pressure drop at 1.5 L/min — ample thermal margin, minimal hydraulic cost. The design closes the modeling → CFD → fabrication → test loop, with measured data feeding back for next-generation chips.

FAQ

Why jet impingement plus microchannels?

Jets remove the near-wall boundary layer for hot spots; fins extend area for overall resistance — together they capture high heat flux at low flow.

Is 1.5 L/min enough?

Measured: 550 W at 1.5 L/min reaches 91 °C. Exact flow follows load and allowed temperature rise.

How are 608 W/cm² peaks suppressed?

Jet holes follow the chip heat map, denser over hot spots; measured peak-flux conditions show no temperature bottleneck.